Our High Grade Compound Solutions
Custom Thermoplastic
Compounds For Advance
Mechplas develops custom-engineered thermoplastic compounds designed for semiconductor packaging, cleanroom environments, conductive applications, and high-performance engineering industries.
Engineered Materials
Built Around Your Requirements
At Mechplas Engineering Plastics, we specialize in developing customized thermoplastic compounds tailored to meet specific processing, electrical, thermal, and mechanical performance requirements.
Our compounds are manufactured in the form of resin pellets and are later processed by customers into semiconductor packaging components, engineering parts, and precision industrial products.
We work closely with customers to formulate compounds that deliver stable quality, reliable performance, and efficient manufacturability.
Conductive Compounds
Materials engineered to provide controlled conductivity and static dissipation for semiconductor and ESD-sensitive applications.
Common Additives
- Carbon Black
- Carbon Fiber
- Conductive Fillers
Typical Applications
- IC Trays
- Wafer Cassette
- Carrier Tape
- Semiconductor Packaging
Antistatic Compounds
Permanent antistatic materials developed for cleanroom packaging and electronic component handling applications.
Features
- Low Surface Resistivity
- Stable ESD Performance
- Low Particle Generation
Typical Applications
- Pellicle Boxes
- HGA Trays
- Cleanroom Packaging
Reinforced Engineering Compounds
High-strength thermoplastic compounds reinforced with glass fiber, carbon fiber, and mineral fillers to improve mechanical performance and dimensional stability.
Reinforcements
- Glass Fiber
- Carbon Fiber
- Mineral Fillers
- Stainless Steel Fiber
High-Performance Engineering Resins
Advanced engineering compounds designed for demanding industrial and semiconductor applications requiring heat resistance, chemical resistance, and superior mechanical performance.
Materials Include
- PPS
- PEEK
- PEI
- PSU
- PES
Base Resins We Work With
Commodity & Engineering Thermoplastics
PP
PE
ABS
HIPS
PC
PIMMA
TPU
PPO/PPE
NYLON
High Performance Resins
PPS
PEEK
PEI
PSU
PEC
LCP
& Many More
Base Resins We Work With
Mechplas compounds thermoplastics with a wide range of functional additives and reinforcing materials to achieve specific application requirements.
- Carbon Black
- Carbon Fiber
- Glass Fiber
- Glass Beads
- PTFE
- Aramid Fiber
- Graphite
- Mica
- Talc
- Flame Retardants
- Permanent Antistatic Agents
- Conductive Additives
- And More
NEEQ A CUSTOM COMPOUND SOLUTION?
Our technical team is ready to develop the right material for your application.
Example Applications Using Our Compounds
The following products represent examples of applications manufactured by customers using Mechplas compounded resin materials.
IC Trays
Conductive and antistatic compounds developed for semiconductor packaging trays requiring dimensional stability and controlled surface resistivity.
Materials Used
- ABS + Carbon Black
- ABS + Carbon Fiber
- PC + Carbon Fiber
- PP + Carbon Fiber
- PPS + Carbon Fiber
Wafer Cassette
Engineering compounds suitable for wafer handling systems requiring strength, conductivity, and cleanroom compatibility.
Materials Used
- PC + Carbon Fiber
- PP + Carbon Fiber
Carrier Tape
Conductive compounds optimized for sheet extrusion and semiconductor packaging applications.
Materials Used
- HIPS + Carbon Black
- PC + Carbon Black
Disc Caddy
Custom conductive compounds designed for semiconductor storage and handling applications.
Materials Used
- PC + Carbon Black
- PC + Antistatic Additives
Pellicle Box
Permanent antistatic compounds suitable for transparent and cleanroom packaging applications.
Materials Used
- ABS + Antistatic Additives
- PMMA + Antistatic Additives
HGA Tray
Antistatic and dissipative compounds designed for precision semiconductor packaging applications.
Materials Used
- PETG + Antistatic Additives
- PC + Carbon Black
Electrical Properties
- Conductive
- Static Dissipative
- Permanent Antistatic
- Controlled Surface Resistivity
Mechanical Properties
- High Strength
- Enhanced Rigidity
- Dimensional Stability
- Wear Resistance
Processing Advantages
- Injection Moldable
- Sheet Extrusion Compatible
- Stable Processing Performance
- Customizable Formulations